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ID 34179
フルテキストURL
著者
Hayashi, Hidetaka Okayama University Kaken ID publons researchmap
Izumi, Shin-ya Okayama University
Tari, Isao Okayama University
抄録

The purpose of this work is to elucidate the factors affecting the codeposition of a-alumina particles with copper from an acid copper sulfate bath. The effect of current density and particle concentration in the bath on the amount of codeposited a-alumina were determined. In order to evaluate the surface-chemical properties of the particles, the zeta-potential of a-alumina particles in the plating bath was determined by means of the streaming potential method. The amounts of adsorbed Cu 2+ and SO2( from the plating bath were also determined. The amount of codeposited a-alumina particles was found to be greater than those reported in literature, in spite of the negative zeta-potential values of a-alumina. This indicates that the electrostatic interaction between the particles and the cathode is not the essential factor of the codeposition process. It is considered that the amount of adsorbed Cu 2+ on the a-alumina particle plays an important role in the codeposition behavior.

キーワード
Deposition
Kinetics
備考
Digital Object Identifer:10.1149/1.2221051
Published with permission from the copyright holder. This is the institute's copy, as published in Journal of the Electrochemical Society, February 1993, Volume 140, Issue 2, Pages 362-365.
Publisher URL:http://dx.doi.org/10.1149/1.2221051
Direct access to Thomson Web of Science record
Copyright © 1993 The Electrochemical Society, Inc. All rights reserved.
発行日
1993-2
出版物タイトル
Journal of the Electrochemical Society
140巻
2号
開始ページ
362
終了ページ
365
資料タイプ
学術雑誌論文
言語
英語
査読
有り
DOI
Submission Path
physical_and_theoretical_chemistry/11