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<ArticleSet xmlns="http://www.openarchives.org/OAI/2.0/">
  <Article>
    <Journal>
      <PublisherName/>
      <JournalTitle>Acta Medica Okayama</JournalTitle>
      <Issn>00078506</Issn>
      <Volume>68</Volume>
      <Issue>1</Issue>
      <PubDate PubStatus="ppublish">
        <Year>2019</Year>
        <Month/>
      </PubDate>
    </Journal>
    <ArticleTitle>High surface quality micro machining of monocrystalline diamond by picosecond pulsed laser</ArticleTitle>
    <FirstPage LZero="delete">197</FirstPage>
    <LastPage>200</LastPage>
    <Language>EN</Language>
    <AuthorList>
      <Author>
        <FirstName EmptyYN="N">Y.</FirstName>
        <LastName>Okamoto</LastName>
        <Affiliation>Graduate School of Natural Science &amp; Technology, Okayama University</Affiliation>
      </Author>
      <Author>
        <FirstName EmptyYN="N">A.</FirstName>
        <LastName>Okada</LastName>
        <Affiliation>Graduate School of Natural Science &amp; Technology, Okayama University</Affiliation>
      </Author>
      <Author>
        <FirstName EmptyYN="N">A.</FirstName>
        <LastName>Kajitani</LastName>
        <Affiliation>Graduate School of Natural Science &amp; Technology, Okayama University</Affiliation>
      </Author>
      <Author>
        <FirstName EmptyYN="N">T.</FirstName>
        <LastName>Shinonaga</LastName>
        <Affiliation>Graduate School of Natural Science &amp; Technology, Okayama University</Affiliation>
      </Author>
    </AuthorList>
    <PublicationType/>
    <ArticleIdList>
      <ArticleId IdType="doi"/>
    </ArticleIdList>
    <Abstract>In micro machining of monocrystalline diamond by pulsed laser, unique processing characteristics appeared only under a few ten picosecond pulse duration and a certain overlap rate of laser shot. Cracks mostly propagate in parallel direction to top surface of workpiece, although the laser beam axis is perpendicular to the surface. This processed area can keep diamond structure, and its surface roughness is smaller than R-a = 0.2 mu M. New laser micro machining method to keep diamond structure and small surface roughness is proposed. This method can contribute to reduce the polishing process in micro machining of diamond. (C) 2019 Published by Elsevier Ltd on behalf of CIRP.</Abstract>
    <CoiStatement>No potential conflict of interest relevant to this article was reported.</CoiStatement>
    <ObjectList>
      <Object Type="keyword">
        <Param Name="value">Laser beam machining (LBM)</Param>
      </Object>
      <Object Type="keyword">
        <Param Name="value">Laser micro machining</Param>
      </Object>
      <Object Type="keyword">
        <Param Name="value">Diamond</Param>
      </Object>
    </ObjectList>
    <ReferenceList/>
  </Article>
</ArticleSet>
