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ID 14069
JaLCDOI
Sort Key
13
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Author
Donghui, MA
Torii, Tashiyuki
Matsuba, Akira
Abstract
As model specimens of surface film-bonded materials, pure copper films with a thickness of 100μm were bonded to the surface of steel base with epoxy resin, where the tensile residual stress was measured by an X-ray on the surface copper film. The distribution of initial electric resistance was measured on both copper film and base specimen by a direct current potential drop technique. As a result, there was a good agreement between the measured and theoretical values. From the fatigue testing results, it was shown that the measured electric resistance increased with the fatigue crack length on the copper film, which was almost equal to the theoretical value calculated for a central slit in a plate with finite width. This was probably because the fatigue crack was opened due to the tensile residual stress on the film even under unloading condition. In addition, the internal crack length during fatigue was examined by ultrasonic testing for the film-bonded specimen. As a result, there was a difference in the fatigue crack length between the surface copper film and the inner base.
Publication Title
Memoirs of the Faculty of Engineering, Okayama University
Published Date
2008-01
Volume
volume42
Issue
issue1
Publisher
Faculty of Engineering, Okayama University
Publisher Alternative
岡山大学工学部
Start Page
104
End Page
109
ISSN
0475-0071
NCID
AA10699856
Content Type
Departmental Bulletin Paper
OAI-PMH Set
岡山大学
language
英語
File Version
publisher
NAID
Eprints Journal Name
mfe