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In the surface mount technology, a ball grid array (BGA) has been used in the production of PC boards. This paper deals with the detection of defects at BGA solder joints in PC boards by using X-ray imaging. Types of defects at BGA solder joints are solder bridge, missing connection, solder voids, open connection and misregistration of parts. The problems of image analysis for the detection of defects at BGA solder joints are the detection accuracy and image processing time according to the speed of the production line. To get the design data for the development of the inspection system used in the surface mount process, it is important to develop image analysis techniques based on X-ray image data. At the first step of our study, we attempt to detect the characteristics of the solder bridges based on the image analysis technique.
ball grid arrays
printed circuit manufacture
surface mount technology
Digital Object Identifier: 10.1109/ICIT.2002.1189898
Published with permission from the copyright holder. This is the institute's copy, as published in Industrial Technology, 2002. IEEE ICIT '02. 2002 IEEE International Conference on, 11-14 Dec. 2002, Volume 1, Pages 191-196.
Copyright © 2001 IEEE. All rights reserved.